At the moment the official information on the Ryzen 3000 refers to the CES 2019 of January, when Lisa Su illustrated some of the fundamental characteristics of the new CPUs and gave a first demonstration of the performances, comparing an 8-core CPU of new generation to a Core i9-9900K , the current top of Intel’s desktop range.
On that occasion, the Ryzen 3000 CPU showed performance that was slightly higher than the Intel processor (2057 vs 2040 points in Cinebench) but with decidedly lower consumption (133 vs 180 watts in Cinebench) . Since then AMD has maintained a fair reserve on the development of the new chip series, suggesting that the new generation could offer up to 16 cores, together with interesting efficiency improvements linked to the new Zen architecture 2.
At Computex 2019, on May 27th, we will most likely get to know all the details of the new solutions, but the rumor machine is always in motion, so much so that new alleged information on future AMD proposals is coming from China . As always, take them with due caution.
According to the source, the motherboard manufacturers have already been testing the Ryzen 3000 CPU engineering samples for some time, since we talk about the first part of the first quarter. The producers would have received samples of quad-core models with which to start setting up the platforms.
Processors based on Zen 2 architecture, again according to the indiscretion, would offer an improvement in IPC (instructions per clock cycle) up to 15% compared to the current Ryzen 2000 proposals based on Zen + architecture. The latter had already improved, albeit slightly (3%), the IPC of the first generation Ryzen.
The samples in the hands of motherboard manufacturers would also be able to reach up to 4.5 GHz in Turbo Boost, with better scaling than in the past for processors with more cores and a higher TDP, probably linked to higher efficiency resulting from the 7 nanometer manufacturing process.
AMD would also have worked to further refine the memory controller , an Achilles heel of the early Ryzen, although in this regard there would be no exceptional steps forward.
As for the platform, the new CPUs will be accompanied by the X570 chipset, which together with the CPU should provide 40 PCI Express 4.0 lines , of which 16 PCI Express 4.0 lines would be dedicated to the expansion slots (8 + 4 + 4). The X570 platforms should also display eight USB 3.1 Gen 2, four USB 2.0 and several SATA ports.
It is rumored that manufacturers initially encountered a problem with the speed of PCI Express 4.0, but a new revision of the motherboards being tested at this time would have solved the problem.
As for a successor to the current B450 chipset, the elusive B550, it is assumed that the X570 will arrive two months later , probably in September, with one fundamental difference: the absence of PCI Express 4.0 support .